Used DISCO DGP 8760 + DFM 2700 #293628033 for sale

DISCO DGP 8760 + DFM 2700 wafer grinding, lapping & polishing equipment is a state-of-the-art technology designed to meet the increasingly stringent requirements for top quality semiconductor chips. This technology allows for much faster and more consistent results than ever before. DISCO DGP 8760 is a multi-purpose grinding device which can be used for face grind, gate grind, flash gate grind, lapping, and polishing in one system. The DGP 8760 is equipped with two circuits - a main grind circuit, used for general grinding, and an auxiliary circuit which is used for thinning. It has an Ethernet interface, allowing it to be used remotely. Additionally, the PC-based control software has automated features which simplify setup and improve the unit's accuracy. The DFM 2700 is the companion machine to the DGP 8760. It is used for lapping and polishing operations, such as oxide grind, polish, backside mirror finish, or total thickness control. The DFM 2700 has a planar grinding table and uses abrasive disks to create a uniform surface. It is equipped with a built-in load monitor, allowing the user to check progress and make adjustments as needed. The automated control tool allows for optimized processing, consistent results and reduced cycle times. DISCO DGP 8760 / DFM 2700 asset is capable of producing ultra-fine ground surfaces, with a flatness of better than 0.5μm, wafer uniformity of better than 1µm, and polish repeatability of less than 0.2µm. This model enables the production of high-quality semiconductor devices with consistent yields and improved process times.