Used DISCO DGP 8760 + DFM 2700 #293633785 for sale

DISCO DGP 8760 + DFM 2700 is a wafer grinding, lapping & polishing equipment ideal for polishing a variety of wafer types, including polysilicon, quartz and gallium arsenide. It is designed to ensure both precise and accurate thin film deposition to meet the most stringent requirements, especially in the metrology and MEMS industries. DISCO DGP 8760 incorporates a high precision grinding spindle to enable precise regrinding, while the DFM 2700 utilizes a digital force sensor to measure and control the grinding force, thus ensuring superior wafer surface quality. In addition, both systems feature independently adjustable articulating arm guides for precise sample alignment for wafer processing. The DGP 8760 grinder is outfitted with a control unit which monitors the spindle's operating conditions and adjusts its pressure according to the programmable parameters and settings. The lapping & polishing process is further enhanced by an isolated air flushing and a high speed pneumatic polishing jet, which ensure the finest possible surface finish without compromising the accuracy of the process. Overall, the system offers state-of-the-art equipment with a wide range of grinding, lapping and polishing applications. Its automated process guarantees the repeatability and accuracy of wafer processing. Furthermore, its open architecture and user-friendly interface provide flexibility for implementing custom processes and applications. Proper care and maintenance is also essential for this unit, which includes daily checking of the chuck pressure, jig, wheels and spindle. Regularly checking for loose pieces and cleaning residual material from the work area is also necessary to achieve optimum performance. To sum up, DISCO DGP 8760 / DFM 2700 machine represents a turnkey solution for wafer grinding, lapping & polishing processes. It includes precision instruments and advanced features, offering the best possible result for a wide range of applications.