Used DISCO DGP 8760 + DFM 2700 #293748558 for sale

DISCO DGP 8760 + DFM 2700 wafer grinding, lapping & polishing equipment is a multi-functional production-level system designed for the manufacturing of micro-scale and millimeter-scale electronic components. This unit processes silicon wafers in stages of grinding, lapping, and polishing. At the beginning of the process, large wafers with rough surfaces are inserted into the DGP 8760's grinding stage. This stage is a mechanical abrasive process which works to flatten and thin the wafer while also smoothing out the top surface. The grinding process is fully automated and ensures the accuracy and quality of the wafer's surface prior to the lapping stage. Once the desired thickness has been achieved, the automatically loaded wafers are passed on to the lapping phase. The lapping stage is a non-abrasive technique that polishes and finishes the wafer's surfaces. The lapping proceeds in two directions with an oscillating slurry of alumina and silicon carbide abrasion particles. This machine has the ability to capture and recycle the abrasion particles typically used in manual lapping processes, allowing for an increased number of processes with less material waste. Additionally, the lapping process uses a low-pressure controlled technique reduced the risk of any damage and contamination of the wafer's surfaces. The final step in the process is the polishing stage. In this phase, the wafers are exposed to a gentle force in order to further refine the smoothness of the wafer's top surfaces. The DFM 2700 is a fully-automated, programmable polishing and buffing machine that utilizes a series of motorized turbine heads and pads to achieve a high level of accuracy and uniformity. DISCO DGP 8760 / DFM 2700 is a powerful tool designed for precise and accurate wafer grinding, lapping, and polishing for the manufacturing of micro-scale and millimeter-scale electronic components. This asset provides a premium finish in a repeatable, reliable, and cost-effective manner.