Used DISCO DGP 8760 + DFM 2700 #293748986 for sale

DISCO DGP 8760 + DFM 2700 is a versatile wafer grinding, lapping, and polishing equipment. This system is specifically designed to process wafers up to 8 inches (200 mm) in diameter. A built-in servo motor ensures the consistent high-quality surface finishes and uniformity of the wafer edges. The DGP 8760 is a heavy-duty multi-axis grinding machine which is capable of performing various operations such as edge grinding, lapping, and polishing. It also provides high accuracy and surface quality control, with its integrated advanced feedback control unit, force and positional sensors. The machine also contains an automated calibration function which continuously feeds data to the machine's central computer, keeping the grinding and polishing operations in perfect synchronization. Additionally, with its variable speed drive, the DGP 8760 is capable of controlling the grinding wheel speed and direction. The DFM 2700 is a fully automated lapping and polishing machine. This machine utilizes two lapping and polishing heads, each with a maximum rotational speed of 400 rpm. The tool is designed to provide high precision surface finishes and to reduce the amount of manual handling and labor required for wafer processing. The asset also features an adjustable stroke and pressure control model which allows for smooth motions along the lapping and polishing process. The DGP 8760 and DFM 2700 are connected via a specialized interface, allowing for communication between the two systems. This ensures optimal performance for the wafer finishing processes being performed. Additionally, the equipment is compatible with DISCO AutoMOSAIC wafer defect inspection system and is capable of automatically correcting any identified defects in the wafers. Overall, DISCO DGP 8760 / DFM 2700 is an ideal choice for any application requiring fast, high quality, and precise wafer grinding, lapping, and polishing. With its advanced features and specialized interface, it is sure to meet any requirements demanded from the wafer finishing process.