Used DISCO DGP 8760 + DFM 2700 #293826154 for sale

DISCO DGP 87600 and DFM 2700 wafer grinding, lapping and polishing equipment offers reliable, automated, precision processing with consistent results. This system is well-suited for use in energy, automobile, precision electronics, semiconductor, photonics and medical device production. Its features make it highly efficient, cost-effective and repeatable across multiple substrates. The DGP 87600 is a fully-automated wafer grinding machine. It is composed of a two-dimensional robotic arm, eight tool holding positions, and a grinding head for crystalline wafers. It offers consistent and accurate grinding, with high repeatability for exact results time after time. This unit also features a highly robust control machine with a fast cycle time, automated parametrization, damage detection as well as support for special processing. The DFM 2700 is a fully-automated wafer lapping and polishing tool. It is composed of a three-dimensional robotic arm with twelve tool holding positions, as well as a lapping and polishing head for common wafer shapes. This asset offers consistent and repeatable results across multiple substrates. It also features a high precision moving stage with integrated sensor technology for true process monitoring. This model is suitable for both coarse and fine grinding, allowing it to achieve the highest possible quality standards. DISCO DGP 87600 and DFM 2700 wafer grinding, lapping and polishing equipment can process a variety of substrates, including those made from curable resins, non-composites, thin films and amorphous materials. Its integrated process control software system allows for real-time monitoring of the grinding and polishing processes. This unit also has a quick cycle time, offering users significant time savings. Moreover, it has low thermal stress in processing, making it highly suitable for use with temperature-sensitive materials. In conclusion, DISCO DGP 87600 and DFM 2700 wafer grinding, lapping and polishing machine is a reliable and cost-effective choice for precision processing. This tool is highly efficient, offering repeatable results across multiple substrates. It is suitable for use in energy, automobile, precision electronics, semiconductor, photonics and medical device production, helping to maximize production yields and reduce costs.