Used DISCO DGP 8760 + DFM 2700 #9236095 for sale

DISCO DGP 8760 + DFM 2700 Wafer Grinding, Lapping, & Polishing Equipment is an automated, integrated system for precision wafer fabrication. DISCO DGP 8760 is a high-precision, two-axis grinder/polisher designed to automatically process substrates and to grind and polish the finest feature resolution surfaces. This unit is designed to reduce processing time while eliminating the risk of contamination. The machine comes with an integrated carrier robot for substrate handling. The robot generates movement along the X-axis, Y-axis, and tilt axis to take the substrates to the grinding, lapping, and polishing processes. The handling robot also lifts and lowers the substrates between carriers with ease. The robot includes up to 4 processing carriers for substrate and fixture loading. DISCO DGP 8760 utilizes advanced software control that automates the entire grinding, lapping, and polishing process. The tool includes two wheels for grinding down a substrate up to the diameter of 8" and only needs two drivers to operate. The wheel attaches and detaches using a chuck mechanism. DISCO DFM 2700 is a double-sided polishing asset for smoothing down irregular surfaces. This model is typically used for precision optical lapping and polishing, allowing fine and high-definition polishing of substrates. The main features of the DFM 2700 include: a servo motor drive equipment that can finely adjust the direction and depth of platen motion, a processing speed of 17 rpm, a CNC control table, and a microprocessor-controlled robotic arm for substrate loading and unloading. DISCO DGP 8760 / DFM 2700 Wafer Grinding, Lapping, and Polishing System is an innovative, fully integrated high-precision unit designed for automatically processing wafers and creating fine feature resolution surfaces. This machine engages robotics technology and advanced software to automate all processes, ensuring accuracy and precision, resulting in a cost-effective wafer production solution.