Used DISCO DGP 8760 + DFM 2700 #9249024 for sale

DISCO DGP 8760 + DFM 2700 is an innovative wafer grinding, lapping and polishing equipment designed to deliver high productivity and a superior surface finish. This system features the high-precision DGP 8760 grind-lap wafer grinder, paired with the ultra-accurate DFM 2700 fine lapping machine, giving the best-in-class combination for precision and efficiency in the most demanding grinding and lapping applications. The DGP 8760 grind-lap wafer grinder is specifically designed for grinding and lapping wafers with thickness ranging from 50 μm to 1.2mm. It incorporates advanced motion control technology, ensuring optimal wafer motion and grinding wheel interaction, which provides superior surface finish and ultra-fine precision grinding. The DGP 8760 also has an ergonomically designed setup allowing for easy and efficient operator handling and operation. For optimal productivity, the DGP 8760 has up to six independently controlled grinding spindles, allowing the user to simultaneously grind multiple wafers across a wide range of sizes and thicknesses. The DFM 2700 fine lapping machine is paired with the 8760, and is a high-precision unit designed for superior lapping and polishing. The 2700 utilizes an advanced air-bearing spindle design, which ensures highly precise and repeatable results with minimal wear on the components. A unique grinding belt transport belt and driven transport rolls enable high-accuracy, high-speed fine lapping and polishing. Additionally, the 2700 is equipped with a customizable control machine, giving the user the flexibility to program lapping operation to their exact specifications and allows for a variety of different lapping processes. The combination of the DGP 8760 and DFM 2700 provide a 3 axis wafer grinding, lapping and polishing solution featuring high-precision and superior performance. The tool has the capability to produce top-of-the-line results throughout the entire operation, making it an ideal choice for high-volume production, process development, engineering, and research and development. Overall, DISCO DGP 8760 / DFM 2700 is an advanced wafer grinding, lapping and polishing solution designed to perform the most meticulous applications. It features a high-precision grind-lap asset and a superior lapping machine, allowing for increased levels of productivity, precise surface finish, and repeatable results.