Used DISCO DGP 8760 + DFM 2700 #9255029 for sale

DISCO DGP 8760 + DFM 2700 equipment is a highly advanced wafer grinding, lapping and polishing system that is designed to provide highly precise grinding, lapping, and polishing of a variety of materials, including semiconductor substrates, hard and brittle materials, and optical materials. The unit utilizes a grinding disc, a lapping disc, and a polishing disc for each material, and is available in either a single or dual-station configuration. The machine utilizes a precision grinding, lapping and polishing disc in order to achieve the desired results. The discs are made from diamond and silicon carbide material, providing the highest precision and accuracy in the grinding, lapping, and polishing of the materials. The discs are mounted on a spindle and driven by an electric motor that is capable of generating adjustable speed and torque. The grinding, lapping and polishing of semiconductor substrates are done using an abrasive mixture that is spun onto the surface of the substrate. The tool also utilizes a pneumatically operated sample mounting device to ensure that the sample is held securely in place during the grinding, lapping, and polishing process. The device is capable of holding a variety of substrate sizes. The operation of the asset is controlled by a highly sophisticated control interface. The interface allows the operator to monitor the process and make adjustments as necessary to achieve the desired results. DISCO DGP 8760 / DFM 2700 model is highly capable of producing high-quality results in a short period of time. The precision and accuracy of the equipment are unmatched by other systems, and the device is suitable for both industrial and laboratory use. Overall, DGP 8760 + DFM 2700 system is the perfect solution for those looking for a high-precision grinding, lapping, and polishing unit. The advanced features of the machine make it an ideal choice for a variety of uses, including industrial and laboratory applications.