Used DISCO DGP 8760 + DFM 2700 #9389537 for sale

DISCO DGP 8760 + DFM 2700 wafer grinding, lapping and polishing equipment is an advanced system designed for wafer surface preparation and material processing applications. DISCO DGP 8760 / DFM 2700 unit includes two units that work together to provide the capability to both grind and polish wafer surfaces, making it suitable for a variety of production and research laboratories. The DGP 8760 is a high speed grinding unit specifically designed to prepare wafer surfaces in an industrial setting. This machine provides high efficiency grinding capabilities while minimizing stresses and physical loading to maintain a high clearance while providing the high quality surface finish required for complex circuit applications. The DFM 2700 is a finisher unit that provides precision polishing and finishing capabilities. This unit uses a two-stage approach, first using simple abrasive technologies to produce a primary finish, then using fine abrasives and advanced finishing techniques for a higher degree of accuracy. The integrated process control tool ensures consistent results while keeping the process times fast and efficient. DGP 8760 + DFM 2700 asset is versatile and easy to use. The wafers are loaded onto the platens of the DGP and DFM units, allowing for difference in sizes and shapes which can easily and quickly be changed during the grinding and polishing process. This model can provide wafer surfaces with a wide range of surface finish capabilities, from large rough grinds to ultra smooth polishing. Overall, DGP 8760 / DFM 2700 is a powerful and reliable equipment providing efficient and accurate wafer surface preparation. With its two-stage approach, it can meet a variety of needs, from industrial production to precision surface finishing for research projects. This wafer grinding, lapping and polishing system is a great choice for any production or research application.