Used DISCO DGP 8760 #293620428 for sale

DISCO DGP 8760 wafer grinding, lapping and polishing equipment is a versatile, high-precision machine designed to grind, lap, and polish large wafers with exceptionally high accuracy and repeatability. It is equipped with independent integrated rotary and linear axes, allowing for variable speed rotation and linear movements as well as precise rotational and tilt guidance for grinding, polishing, lapping, and more within the range of 1mm to 200mm. Furthermore, the system is programmed with a GUI software, providing operators an intuitive interface to adjust the unit's parameters such as spindle speeds and feedrates while monitoring the sequence of operations and real-time results. The machine is composed of a rigid, monoblock base including a precision spindle attachment and swivel-head designed with high-resolution encoders at both rotary and linear axes. The software, along with the moveable head and cnc programming, allows for tremendous flexibility and feature accuracy. Thru-feed grinding is made possible with variable speeds between 0.01 and 300rpm, facilitating grinding operations with high repeatability and surface finesse. The high-speed grinding method minimizes thermal strain and maximizes perfection in the form of parallel, semi-parallel and angled surfaces. The machine boasts a fully automatic disc abrasive changer, as well as multiple buffers for the abrasive disc feed, allowed the user to program three different kinds of grinding disc with the click of a mouse. Finally, a wafer chiller tool can be added, in order to minimize thermal change that could possibly alter the surface topology of the sample. The main functions of the machine are grinding, lapping and polishing, but DISCO DGP8760 does not stop there. An optional vacuum coating attachable to the asset can provide layers of protective material such as silicon oxide or alumina onto wafer samples, making this model a multi-functional tool for even more sample types. With multiple peripherals and high-accuracy feeding, DGP 8760 is the perfect choice for reliable, controlled operation and precision results for your wafers.