Used DISCO DGP 8760 #9038367 for sale

DISCO DGP 8760 is a wafer grinding, lapping & polishing equipment developed by DISCO Corporation. This wafer process system is capable of achieving precise lapping and polishing for demanding applications such as achieving fine surface finish and flatness. It has an efficient automation unit with a user-friendly graphical interface and supports multiple tools for grinding, lapping and polishing wafers. The main components of DISCO DGP8760 machine are the grindstone, polishing pad, and spindle. The grindstone is set into a headstock and is driven by a motor which oscillates the grindstone in order to grind the wafer. The motor is controlled by a programmable CNC machine which can achieve different grinding speeds and patterns. The polishing pad is used to further polish the wafer after the grinding process. It is set in a motion stage and rotated in a constant direction and speed, while a polishing compound is supplied between the pad and the wafer. Finally, the spindle is used to hold the wafer during the lapping and polishing process and is fitted with a PID controller to precisely control the rotating speed. For the grinding process, DGP 8760 has several tools available to ensure tight process accuracy. It can automatically select the most appropriate grinding condition and set the motor oscillation speed for the grinding process. In order to achieve the highest quality lapping, DGP8760 supports the use of a variable speed lapping head to ensure optimal control of the lapping process. The polishing pad can be adjusted to different speeds using a touch panel in order to achieve the desired surface finish. Finally, the spindle has a PID controller to ensure precise control of the rotating speed. In addition to fine surface finish and flatness, DISCO DGP 8760 is capable of achieving fine line widths and other CMP related operations. Other features of this tool include an auto-reset function, dust control, water supply, and automatic mapping for non-uniform wafer surfaces. Overall, DISCO DGP8760 is a highly precise wafer process asset for grinding, lapping, and polishing wafers. Its efficient automation model and various grinding, lapping, and polishing tools make it an ideal choice for a wide range of applications. Furthermore, its PID controller and touch panel allow for automated control of the grinding and lapping process for higher throughput and higher quality results.