Used DISCO DGP 8760 #9229632 for sale

DISCO DGP 8760 is a wafer grinding, lapping and polishing equipment that offers an all-in-one solution for the processing of semiconductor and optoelectronic devices. With a variety of automated functions and features, DISCO DGP8760 system provides a reliable and efficient means of completing the fabrication of a variety of substrates. The unit features a unique angular adjustment between the table and the spindle head to ensure precise alignment of the grinding, lapping, and polishing heads. The integrated variable frequency drive ensures smooth and consistent table speeds while a full-size turntable provides a flexible and accurate platform for the entire process. DGP 8760's large single stage grinding capacity handles a variety of sample sizes and thickness with ease, while its lapping and polishing capabilities are optimized for diamond and silicon oxide finishes. With a range of automatically controlled parameters, the machine can be tailored to meet the specific needs of individual applications. DGP8760 also includes a powerful range of data recording and analysis features with full traceability of all processes performed on tool. A comprehensive catalog of standard operating recipes provides a fast and reliable means for job setup and can be further customized to fit unique needs. A Graphic User Interface is also provided as an intuitive and comprehensive means of monitoring and controlling the asset. Overall, DISCO DGP 8760 Wafer Grinding, Lapping and Polishing model's feature-set provides a powerful yet accurate and reliable platform for the fabrication of a wide range of semiconductor and Optoelectronic devices. Its automated functions and intuitive interfaces allow for fast job setup and processing with a minimum of user input. This, in combination with its flexibility and traceability capabilities make DISCO DGP8760 an ideal choice for a wide array of applications.