Used DISCO DGP 8760 #9251995 for sale

DISCO DGP 8760 is a wafer grinding, lapping & polishing equipment specifically designed for processing thin films and substrates, especially silicon wafers. It is suitable for a wide range of applications, from polishing wafers to surface roughness control, lapping and deburring. DISCO DGP8760 combines an abrasive-free "process disc" with a high output pump system to achieve high throughput grinding and lapping rates. The process disc utilizes diamond paste and a unique disc technology to grind, lap, and polish the surface of the workpiece. This process disc uses a revolving plate, and an integrated driving mechanism to spin the workpieces uniformly across its surface. The process disc also has a float-on, floating-ring, on which the workpiece is held while a uniform drive is applied. DGP 8760 has a built-in high-precision touch screen with a number of process parameters to control the grinding and polishing process. The user can select the media for use, the grinding speed, and the polishing time to create the desired surface finish. DGP8760 also has high precision temperature control, so that the workpiece is not subjected to excessive heat during the grinding process. DISCO DGP 8760 has several safety features to ensure the safe and efficient grinding, lapping, and polishing of thin films. These include a risk of injury prevention unit, which ensures that no foreign matter enters into contact with the wafer being processed. Additionally, the machine is equipped with a vacuum assisted grinding tool, which keeps small particles away from the workpiece. DISCO DGP8760 is a very efficient and robust wafer grinding, lapping, and polishing asset. Its efficient and consistent performance, coupled with its ability to process thin films with precision and repeatability, makes it an ideal choice for a wide range of applications. It is especially suitable for the production of high-tech thin-film products, such as sensors, transistors, and memory chips.