Used DISCO DGP 8761 + DFM 2800 #293652194 for sale

DISCO DGP 8761 + DFM 2800 wafer grinding, lapping, and polishing equipment is an automated, high-precision engineering solution for the production of ultra-smooth wafers with an exceptionally high degree of accuracy. By utilizing DISCO proprietary air bearing spindle technology, high precision rotation and smooth, repeatable control of both the grinding and the lapping and polishing stages, the system produces ultra-flat surfaces with a minimum surface roughness of ⅒ µm (12356 nm). The grinding stage in the unit uses a double disc configuration and automated depth control to remove thinning, round edge, and bumps on the surface of the wafer in order to create a high degree of surface quality. The lap and polishing stage also employs a double-disc configuration and uses diamond compound to polish the sample down to the desired surface finish and smoothness. The machine is further improved by its programmable motion control and dedicated CNC tool, which provide precise and repeatable control of the grinders and lappers. In addition, the asset features a wide range of grinding and polishing tools to achieve a wide range of substrates, such as aluminum, titanium, stainless steel, zinc and other metals, as well as glass and ceramics. The model also features an optional Ceramic and Diamond grinding wheel, which can be used for ceramic-on-ceramic lapping operations, further increasing the equipment's capability. Furthermore, the system is designed with safety and user convenience in mind. Safety features include a Programmable Start/Stop unit for safe, hassle-free operation and a Protective Cover that ensures an unobstructed view of the grinding and lapping area, reducing the risk of injury. A Programmable Accumulator allows for accumulation of the sample material, ensuring that all samples are the same size and the same size is used for each sample. Additionally, the machine is pre-programmed with a range of industry standard grinding and polishing recipes that can be customised to specific requirements. Overall, DISCO DGP 8761 / DFM 2800 wafer grinding, lapping, and polishing tool is a robust and reliable engineering solution for producing ultra-smooth wafers with an incredibly high degree of accuracy. By utilizing the highest precision spindle technology and CNC systems, the asset delivers the desired surface finish and flatness, guaranteeing consistent and repeatable results, batch after batch.