Used DISCO DGP 8761 + DFM 2800 #293662957 for sale

DISCO DGP 8761 + DFM 2800 equipment is a specialized wafer grinding, lapping, and polishing system designed for optimal precision and efficiency in semiconductor wafer processing. Its advanced design allows for increased control and precision in the grinding, lapping, and polishing of semiconductor wafers for a wide variety of applications. The unit consists of two separate components: the DGP 8761 wafer grinding machine and the DFM 2800 lapping and polishing machine. The DGP 8761 is a fully automated, high-precision wafer grinding machine that is designed to deliver increased accuracy and control, even in extreme heat and abrasive conditions. It features a quick and responsive PC-based control machine, along with an easy-to-use interface that allows you to customize its operations, making for smoother operation and improved throughput. The DFM 2800 is a high-precision lapping and polishing machine that offers improved accuracy and flexibility in dual-sided polishing. Equipped with a robust drive tool, it is designed to process substrates from 1µm to 3µm in thickness. This machine acts as a powerful finishing tool, offering superior control over the lapping and polishing process with superior surface finishes and high levels of technical accuracy. In combination, these two machine components offer a highly advanced solution for wafer grinding, lapping, and polishing. The automated setup allows for consistent results, even in extreme conditions. These processes are all carried out with precision and efficiency, giving users full control over their precision requirements. The equipment allows for quick production of complex devices with minimal waste, making it an ideal solution for advanced semiconductor wafer processing.