Used DISCO DGP 8761 + DFM 2800 #293827085 for sale

DISCO DGP 8761 + DFM 2800 is an industry-leading wafer grinding, lapping and polishing equipment designed to provide superior performance when grinding, lapping and polishing large flat substrates for integrated circuit fabrication. The system utilizes the combination of DISCO DGP 8761 grinding and polishing platform and the DFM 2800 lapping and polishing platform, with three heads working simultaneously, to ensure efficient and accurate processing of wafers up to 8" in diameter. DISCO DGP 8761 grinding and polishing platform utilizes a unique five-zone design that is controlled by a powerful, touch-screen interface and offers a variety of process packages to effectively grind, lap and polish substrates. The platform is equipped with an automated wafer indexer to ensure accurate substrate loading, a fully integrable SEMI-flow ultrasonic cleaning unit, and a multi-step, high-power, high-performance abrasive machine. To ensure accurate and consistent process control, the platform is fitted with independent spindles and valves to control the speed and pressure applied to the substrate. The DFM 2800 lapping and polishing platform utilizes two precision polishing heads to accurately lap and polish substrates up to 8" in diameter. The platform is also equipped with a high-performance abrasive slurry tool and an integrated cooling asset to prevent thermal damage and minimize the potential for edge beveling. The DFM 2800 also features an automated wafer height control model, that uses non-contact sensors to ensure that the substrates are held at an optimum height for the lapping and polishing process. Overall, DISCO DGP 8761 / DFM 2800 is an industry-leading wafer grinding, lapping and polishing equipment that provides a high degree of accuracy and flexibility when grinding, lapping and polishing large flat substrates. The system combines the automated wafer indexers and high-precision polishing heads of DISCO DGP 8761 and DFM 2800 platforms, respectively, with a variety of process packages to ensure efficient and accurate processing. The automatic wafer height control and integrated cooling unit of the DFM 2800 further ensures precision polishing and cooling of the substrate, providing users with higher yields and an improved process flow.