Used DISCO DGP 8761 + DFM 2800 #9216208 for sale

DISCO DGP 8761 + DFM 2800 is an integrated wafer grinding, lapping, and polishing equipment used in the manufacture of semiconductor wafers. This system combines the most advanced features of state-of-the-art technologies in order to provide a comprehensive and reliable solution for all stages of wafer processing. The unit starts with a single wafer grinding stage, which is equipped with a PRO-200 diamond grinding wheel and a high-performance motor for precise and accurate grinding. This stage enables the user to achieve high-standard wafer surface quality and improved throughput. The grinding wheel is programmable via a 16-bit precision controller, allowing for custom grinding programs. Once grinding is complete, the wafer is moved onto the lapping stage where a combination of diamond lapping plate and lapping film are used to produce a uniform and scratch-free surface. Depending on the requirements, different grades of diamond lapping films are used to achieve the desired results. The lapping wheel is precisely positioned via a DC motor and the machine also includes a set of advanced, programmable LEDs for accurate automated positioning. After lapping, the wafer is ready for polishing, which is accomplished using a vacuum polishing chuck. During polishing, the chuck uses a high-pressure jet stream of air and a brush to remove particles and achieve a scratch-free surface finish. The tool also features a variable speed control, allowing users to easily adjust the polishing speed to achieve smooth surfaces. Finally, DISCO DGP 8761 / DFM 2800 comes with an optional Clean Room package, which enables the asset to be used in pressurized clean rooms. The package includes a gas transfer model and a vacuum pump, to maintain the cleanliness of the processing environment and ensure high-quality wafers every time. Overall, DGP 8761 + DFM 2800 is a reliable and powerful wafer grinding, lapping and polishing equipment designed to achieve the highest quality results. It incorporates advanced features and programmable technologies to ensure a comprehensive and efficient wafer manufacturing process.