Used DISCO DGP 8761 + DFM 2800 #9401990 for sale

ID: 9401990
Vintage: 2018
Grinder 2018 vintage.
DISCO DGP 8761 + DFM 2800 'wafer grinding, lapping and polishing' equipment is a highly advanced automated production solution for modern semiconductor production. It is designed to deliver high quality, reliable, repeatable and defect-free surface finishes for a variety of edge configurations and wafer sizes. DISCO DGP 8761 / DFM 2800 system utilizes the latest technologies from DISCO "act-on" portfolio to deliver superior performance. It is equipped with a 6 axes robotic arm, integrated thermal process control and advanced statistical process control to ensure process repeatability and consistency. The unit is capable of processing both bare and fully packaged wafers, up to 12 inches in diameter and up to 0.6 mm thick, with very precise and uniform grinding, lapping and polishing capabilities. The robotic arm on the machine offers a range of motion that covers the entire surface of the wafer, including the edges. This ensures a consistent finish on all sides of the workpiece. It also allows up to 12 grinding, lapping and polishing steps to be performed in a single cycle. The arm is inherently safe and is equipped with advanced vision systems to ensure precise positioning and alignment. The thermal control tool in DGP 8761 + DFM 2800 is tightly integrated with the robotic arm to maintain and monitor temperature during the process. This ensures a uniform process, with consistent processing conditions across the entire wafer. Finally, DGP 8761 / DFM 2800 asset is equipped with advanced statistical process control that provides real-time monitoring of the processing parameter and data analysis. This allows for precision tuning of the process parameters to ensure optimal process productivity and yield. All in all, DISCO DGP 8761 + DFM 2800 'wafer grinding, lapping and polishing' model is a powerful, automated production solution for modern semiconductor production. It is designed to deliver extremely precise and uniform grinding, lapping and polishing finishes, using the latest technologies to ensure repeatability and consistency. The integrated robotic arm and thermal control systems ensure the highest quality of surface finishes while the advanced statistical process control ensures optimal process productivity and yield.
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