Used DISCO DGP 8761 #293629542 for sale

DISCO DGP 8761 is a high-performance wafer grinding, lapping, and polishing equipment. The system is designed to process wafers at a size range of 2" to 8" in an automated fashion. DISCO DGP8761 is a multi-stage unit that is capable of performing various processes to match customer requirements. The machine performs wafer grinding processes using a diamond grinding wheel. The process is aided by wide band oscillation, causing the grinding wheel to vibrate in a continuous manner. This is to ensure that all of the surfaces of the wafer are rounded off or leveled properly. The resulting surface is excellent in terms of both flatness and rugosity. Lapping is employed to get the wafer to a higher level of flatness. The process takes place in a slurry tank, where the wafer is bonded to a rubber pad and rotated in a swirled action. The process is aided by a silicon oxide slurry at the bottom of the tank which will smooth the wafer surface. The result is a flat and smooth surface that is ready for polishing. The tool provides superior polishing performance by utilizing a Peltier cooling asset below the polishing pad. This maintains the polishing contact relief extremely low, allowing for higher dimensional accuracy and excellent surface finish. In addition, the polishing pressure can be adjusted so that the wafer does not deform during the course of the process. Furthermore, specific processes can be automated and integrated into the model to reduce the processing time. The control software enables flexible programming of the equipment and provides an easy to use interface to manage and monitor operations. The software also can integrate multiple operations into one process which increases the efficiency of the production process. In conclusion, DGP 8761 is a specialized wafer grinding, lapping and polishing system. It takes advantage of sophisticated automation and vast process capabilities to yield high quality results. The multi-stage unit is designed to ensure that all surfaces of the wafer are processed in a professional manner.