Used DISCO DGP 8761 #293630328 for sale

DISCO DGP 8761 is a compact, high-precision automated wafer grinding, lapping and polishing equipment. The system is designed for the efficient grinding, lapping, and polishing of semiconductor wafers and precision flat parts up to 8" (200mm) in diameter. A rotating chuck holds the wafer or part in place, enabling the operator to control the speed and angle of the grinding and polishing wheels. The unit has a polished metal grinding disc with a special surface finish (RA8) to prevent particles from sticking to the disc, thereby contributing to increased polishing efficiency. It also features a unique dust-extraction machine that eliminates most dust particles created during the grinding and polishing process, allowing for a clean and safe working environment. The grinding and polishing process is controlled via a programming panel with a touch sensitive LCD display. The panel features various parameters that can be adjusted, such as: speed and angle of the disc; direction of the disc motion; and location of the grinding points. The operator can also select from several grinding and polishing modes, depending on the desired result. The tool is highly efficient, as it can process 5-inch (125mm) wafers in 2 minutes and 12-inch (300mm) wafers in 8 minutes. This makes it ideal for batch production, as well as for single wafer processing. DISCO DGP8761 has a variety of safety features, such as door and emergency switches, an air-cooling asset, and a safety interlock switch, that ensure operator safety during operation. In addition, the model can be equipped with an array of various accessories, including various lapping and polishing wheels, grinding discs, cool air jet, and a jig equipment. This ensures that the system can be customized to suit the needs of any application. All in all, DGP 8761 is a compact, efficient, and customizable wafer grinding, lapping and polishing unit. Its combination of high-precision capabilities, speed, and safety features make it an ideal solution for wafer processing, precision parts grinding and polishing, and batch production applications.