Used DISCO DGP 8761 #293659628 for sale

DISCO DGP 8761 is an advanced wafer grinding, lapping and polishing system that provides superior surface finish and uniformity. It is designed for a wide range of applications including uniform grinding or lapping of semiconductor wafers and optoelectronic substrates. DISCO DGP8761 features an air bearing powered adjustable spindle, digital speed control, and built-in high precision temperature control. Its heavy-duty all metal construction and durable cast iron base provide a sturdy foundation that is stable enough to handle the most rigorous applications. The integrated precision digital readouts and digital speed control of DGP 8761 allow for precise and repeatable results. DGP8761's advanced grinding head system features double-headed belts that deliver high-quality edge grinding and polishing. This is complemented by a pneumatically adjustable pressure regulator for fine-tuning the grinding/polishing workload. Additionally, the grinding spindle hand swivels at any angle or direction with a simple turn of the handle, enabling easy alignment during the grinding or polishing process. DISCO DGP 8761 also offers two lapping plates, allowing for more versatility when grinding. The first lapping plate is designed to grind at higher speeds with maximum abrasive surface coverage. The second is a controlled-action lapping plate that ensures a slower and more delicate action for finer, higher quality polishing. DISCO DGP8761 is controlled via a highly intuitive user interface, complete with a graphical display for the precise control of the grinding and polishing parameters. The graphical display is also integrated with a control module that can be programmed with customized settings depending on the parameters desired for a particular application. DGP 8761's integrated storage drawer makes it easy to keep the machine clean and organized. It features a simple-to-use locking mechanism as well as quick-release clamps for easy cleaning. This ensures the machine is always available and ready when needed. Overall, DGP8761 is an advanced and reliable wafer grinding, lapping and polishing system that is well suited for a wide range of applications. Its precision engineering and automated functions make this machine an ideal choice for businesses and research laboratories who require high-performance polishing and grinding.