Used DISCO DGP 8761 #293686496 for sale

DISCO DGP 8761 is a wafer grinding, lapping, and polishing equipment. The system is used in the production and fabrication of semiconductor device wafers, such as those in integrated circuits or in MEMS devices. It is designed to provide a high level of precision in creating various wafer shapes and sizes. DISCO 8761 comes with a main spindle and several additional spindles which measure and grind the incoming wafer material. The spindles are made of stainless steel and rotate at a precise rate of speed, and feature a user-friendly interface. The spindles also hold the wafers in place to be ground and timed. This is done in order to ensure uniform grinding and lapping. The machine features an automated grinding process. This process controls the pressure and speed of the spindles, the number of times it passes over the wafer, and the amount of packaging and material removal. The machine also features a safety unit that will stop the grinding process if a deviation in size is detected. DISCO 8761 can achieve very precise grinding and lapping results that meet the tight tolerances created by manufacturers. The machine features the ability to grind and lap wafers with repeatable accuracy to a few tenths of a micron. It is also capable of producing high quality, uniform wafers in a the fraction of the time as other systems. DISCO 8761 also incorporates a number of additional features, such as dry and wet grinding, a storing and retrieval machine, and advanced process monitoring and control. All these features are designed to allow the user to effectively produce quality wafers without wasting time and energy. DISCO 8761 is an effective and practical tool for high volume wafer production and fabrication. It provides a cost effective and reliable solution for creating complex wafers. It is often used in laboratories and research facilities for the production of prototypes, as its accuracy and repeatability makes it ideal for creating small batches of wafers.