Used DISCO DGP 8761 #293762674 for sale

The Discovery 8761 is a wafer grinding, lapping, and polishing equipment designed specifically for the semiconductor, MEMS, and optoelectronic industries. This system is designed to provide maximum efficiency and precision in all wafer processing operations. The unit features a work envelope of 460 mm x 450 mm x 150 mm and is capable of supporting 200 mm and 300 mm wafers. The grinding, lapping, and polishing mechanism uses diamond suspension fed from a 1-liter syringe pump for precise, uniform processes and a proprietary process control algorithm for best performance. DISCO DGP 8761 is a fully automated machine, complete with process controls including the ability to select different grinding and polishing speeds, process times, sample types, and process parameters. DISCO DGP8761 is equipped with a highly efficient drive mechanism associated with a high speed spindle motor to provide maximum grinding, lapping, and polishing performance. The drive also features a motor bearing monitor to provide feedback on the motor condition during operation. This tool is also configured with various safety features including emergency shut-off switches, emergency stop buttons, and adjustable speeds to prevent unauthorized access and operation of the asset. Moreover, it allows operators to maintain accurate temperature control and integrity through a Peltier-thermoelectric cooling model integrated into the equipment that allows tight temperature control and uniform sample cooling. All processes, from the initial grinding process through to the final polishing process, are controlled by a graphical user interface that provides intuitive_operation and automated process parameters. This intuitive system makes it easy for operators to monitor the progress of processes and make adjustments as needed with minimal set-up time. In addition, DGP 8761 is designed to provide a clean, dust-free working environment. It is enclosed in a Class 1000 cleanroom and features an airless delivery unit for dust-free wafer handling and an anticorrosive anodized aluminum housing for durability and low maintenance. The Discovery 8761 wafer grinding, lapping, and polishing machine is a reliable and high performance tool, designed to provide superior efficiency and precision for precision wafer processing. With its intuitive user-interface and built-in safety features, the Discovery 8761 provides an operator with the perfect platform to control wafer processing with excellent results.