Used DISCO DGP 8761 #293764561 for sale
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ID: 293764561
Wafer Size: 6"-8"
Vintage: 2009
Grinder / Polisher, 8"
Cassette loading / Unloading
Maximum wafer thickness: 1.8mm
(3) Splindles: 320, 2000 wheels, polishing pad
Chuck, 6"-8"
Height guage: 0-1.8 mm
Alignment system
DTU1531 Chiller: 23±1°C
DISCO VG256-15Z-D07 Vacuum unit
CDA: Single channel, 0.6-0.8 MPa
Cool water: 25 L/min
DI Water: 40 L/min
Exhaust: Single channel, 160-400 Pa
3-Axis:
Z1, Z2: Grinder
Z3: Polisher
Wafer transport section:
(2) Cassettes (Left: 6",right: 8")
(2) Arms
(25) Wafer cassettes
Robot
Power supply: 3 Phase, 200 V, 50/60 Hz, 90 A
2009 vintage.
DISCO DGP 8761 is a high-tech, high-precision wafer grinding, lapping and polishing equipment designed to ensure superior performance in the most demanding industrial and research applications. It has been engineered to yield exceptional results in an automated, unattended fashion, ensuring a high level of wafer grinding, lapping and polishing quality. DISCO DGP8761 is comprised of a grinding unit and a lapping unit, both of which boast superior performance. The grinding unit is equipped with a high-precision, high-torque motor that can achieve speeds of up to 36,000 rpm. This unit also features a high accuracy spindle and advanced vibration dampening technology for superior surface finish quality. The lapping unit is equipped with an advanced drive system that enables superior precision during lapping and polishing processes. This unit features two high-quality bearing units and a horizontal motion unit that provide superior control of surface quality and uniformity. To further ensure surface uniformity, the lapping unit is equipped with a high-precision control machine which enables precise adjustment of load and accurately maintains the surface finish specified. Both the grinding and the lapping unit are operated via a highly user-friendly graphical user interface (GUI). This intuitive interface allows operators to quickly and easily setup the tool and monitor its operation. Furthermore, DGP 8761 also comes with a host of diagnostic tools to ensure reliable and accurate operation. In addition to a superior grinding and lapping performance, DGP8761 also offers unmatched convenience and efficiency. It has a small footprint that fits easily into existing production lines, and its modular construction allows users to expand its performance as required. Last but not least, it comes with a host of safety features including an emergency stop button, a vibration monitor, and a 'safe mode' that prevents injury to machine operators. DISCO DGP 8761 truly exemplifies cutting-edge performance and precision in wafer grinding, lapping and polishing. With its intuitive design, superior performance and convenience, DISCO DGP8761 is the perfect choice for every demanding production facility.
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