Used DISCO DGP 8761 #293772279 for sale

DISCO DGP 8761 is a wafer grinding, lapping and polishing equipment, designed to provide an integrated solution to all customer needs in the production of semiconductor wafers. It features an advanced control system that can be programmed to handle a range of wafer grinding, lapping and polishing operations, including shaping, edge grinding and chamfering. The unit is designed to produce high-precision, high-quality finish on all types of wafers such as SSi, SiGe, GaN, MEMS, and ALD. DISCO DGP8761 provides an integrated solution for all kinds of automated wafer grinding, lapping and polishing requirements. It features a large grinding area with adjustable spindle speed and a tilting rotary table to facilitate marking and edge grinding. It also contains a series of high-torque drive motors and a CNC control machine that allows detailed programmed operations. The tool also contains a cooling asset to ensure constant cooling of the spindles and clamping force for longer life expectancy. The model is equipped with a variety of grinding tools such as diamond, aluminum oxide, and cubic boron nitride (CBN) to produce a wide range of high quality finishes on the wafers. The grinding process is fast and highly precise with the capability of producing wafer sizes from 200mm to 300mm without further processing. The feature also helps minimize defects and create high quality, defect-free edges in a much shorter time. DGP 8761 also has several optional features, including a wafer centering unit, a profiling device, a polishing head, and a wafer chamfering unit. The wafer centering unit is used to center the wafer accurately before grinding, while the profiling device is used to create a precise profile on the wafers for controlled lapping and polishing. The polishing head allows for controlled polishing of flat surfaces, while the chamfering unit is used to create uniform chamfers along the edges of the wafer. DGP8761 is an advanced wafer grinding, lapping and polishing equipment that is suitable for a variety of precision applications in the semiconductor industry. It features reliable and accurate operation, with an advanced CNC control system and a host of optional features. It is the ideal solution for cost-effective production of high quality, defect-free wafers in today's demanding semiconductor industry.