Used DISCO DGP 8761 #293772844 for sale

DISCO DGP 8761 is a Wafer Grinding, Lapping & Polishing equipment designed to handle large wafer sizes and reduce the total polishing time. The wafer grinding, lapping and polishing machine can process up to 8" wafers, and offers low damage grinding for a variety of materials such as SiC, SiN, GaAs, Silicon and glass. The precision grinding spindle and high-precision lapping system produce results with the lowest possible surface roughness, while maintaining the lowest possible chip removal rates. The unit utilizes an in-line grinding architecture in which lapping and grinding are coordinate with each other to optimize the total polishing process. It is designed to reduce non-uniformity of the workpiece surface and minimize wafer-to-wafer variation during processing. The machine is equipped with an integrated wafer edge grinding machine which allows for easy repositioning and reduction of edge burrs near the wafer edge after grinding. DISCO DGP8761 features fast wafer rotation speed for better autofocusing, improved productivity and enhanced process uniformity. The machine is also configured with a temperature controlled process medium tank to ensure an optimal condition for the grinding process. The tool is equipped with a programmable height control asset, allowing for precise control of the grinding wheel over the wafer's surface. The model also includes a VIS200 control unit, which offers a user-friendly graphical user interface with onboard diagnostics. This interface allows for easy parameter settings, including sample sizes, sample shapes, grinding wheel diameters, and polishing speeds. The control unit links to a computer, to enable long-term monitoring of process data as well as data storage. DGP 8761 meets various grinding and lapping applications and is ideal for the semiconductor industry, as it produces highly accurate results, and offers ease of use, with its simple user interface and onboard diagnostics. It is a cost-effective and reliable solution to granular and micro-level wafer processing.