Used DISCO DGP 8761 #293801974 for sale

DISCO DGP 8761 is a wafer grinding, lapping and polishing machine designed to provide superior performance in the processing of silicon wafers. The compact design of the equipment allows for optimal usage of available workspace and requires minimal operator intervention to effectively run the system. The unit utilizes abrasive grinding belts to facilitate a uniform grind across the surface of the wafer, with an adjustable belt tension to increase grinding accuracy. A precision rotary table allows for a repeatable process free from vibration and can be set to follow drawing of the desired wafer size. The X-Y drive can independently and accurately adjust the wafer position both horizontally and vertically in order to ensure fast and accurate grinding of the wafer surface. The integrated automated lapping head allows the control of both radial and angular pressures independently to optimize the uniformity of the lapping process. The machine is equipped with an advanced polishing module consisting of a flexible polishing platens which can be adjusted for variable pressure depending on the type and size of wafer being processed. The adjustable pulley drive ensures accuracy and consistency in the polishing process. The flatness measurement and after-polishing quality check tool validate the flatness of the wafer. DISCO DPG 8761 also features a modern user interface which allows the operator to set parameters for wafer size, lapping and polishing pressure, and contamination control. The asset also records all process parameters for further analysis, ensuring rapid and accurate feedback on process efficiency. DISCO DPG 8761 is designed for fast and consistent performance, ensuring the highest quality of processed wafers. The model is also designed to be operated with minimal input from the operator and to be easy to maintain and service for optimal long-term operation.