Used DISCO DGP 8761 #293826070 for sale

DISCO DGP 8761 wafer grinding, lapping & polishing equipment is a machine designed for the efficient and precision grinding, lapping and polishing of a variety of semiconductor and other substrates. This system allows for wafer processing with high accuracy and high throughput, and its construction is robust against high temperatures and debris. DISCO DGP8761 is based on a 4-axis (X, Y, Z, Ω) robot platform, which provides both motion control and real-time sense-and-feedback functions. A multi-function scanning bar is installed in the X axis to ensure precise fine adjustment capabilities. An integrated grinding, lapping and polishing unit consists of an integrated grinding and polishing spindle, a cooling machine to minimize thermal stress, and a dust collector to collect any particles generated during processing. In addition to the spindle, the tool also includes diamond polishing pads, grinding wheels, and a dust collector. DGP 8761 is programmable for multiple wafer sizes and one can easily select from a variety of factors, such as grinding speed, lapping rate (L/D), polishing time, etc. in order to customize the desired process result. Using a combination of these parameters, the asset can achieve a smooth surface of less than one micrometer in size. DGP8761's user interface is highly intuitive and easy to use, allowing even relative beginners to quickly become familiar with the model. In addition, data can be saved and retrieved from a USB memory stick or a built-in hard drive. A real-time data display is also available, allowing the user to monitor the performance of the equipment in real-time. DISCO DGP 8761 is designed to meet the rigorous demands of high performance and reliability in the semiconductor production industry. Its simple and robust design, coupled with its powerful control software, enable the system to deliver reliable and repeatable results. The unit is also backed by a comprehensive after-sales support from DISCO.