Used DISCO DGP 8761 #293827964 for sale

DISCO DGP 8761 Wafer Grinding, Lapping & Polishing Equipment is a versatile system designed to process semiconductor wafers up to 300mm. This unit features an advanced selection of tools for grinding, lapping and polishing wafers up to 8" in diameter, in a variety of shapes and sizes. DISCO DGP8761 is driven by an integrated direct drive motor for precise and powerful wafer processing operations. The machine includes an automatic dual-head grinding tool with an optional integrated polishing head for added flexibility. The drive asset is capable of manipulating heavy wafers with precise control and high inherent stiffness. An automatic loading/unloading model is included for rapid processing. This equipment also offers quick product changeovers with the incorporation of a Tool Change System and robot port (TSR). Additionally, the unit is designed for automated processing and flexible process capabilities that can be easily tailored to meet customer requirements. DGP 8761 includes a semi-automatic designed analog control box that gives users control of the motor speed and process timing. The tool can also be programmed to switch tools automatically, so that users can focus on the process at hand and the results they want. To assure users the highest process quality and precision, DGP8761 includes a proprietary control machine. This advanced control tool automates the entire process from wafer loading to the results for a smoother, improved operation. To support a safe, clean operation, DISCO DGP 8761 is also equipped with a built-in dust free wet grinding asset. DISCO DGP8761 is the perfect model for precision wafer grinding, lapping and polishing. Its robust design allows users to consistently achieve high levels of quality assurance, while its intuitive control equipment makes it simple to operate. With the addition of the TSR,products can be quickly changed over making it an all-around ideal processing system for a variety of wafer processing applications.