Used DISCO DGP 8761 #293828227 for sale
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ID: 293828227
Wafer Size: 6"
Vintage: 2023
Grinder, 6"
Open cassette
Cables
SECS II Interface
DTU 1553 Temperature control
UPS
Power supply
Exhaust pressure
Z2-axis spindle parallelism
Z2 Spindle Flat Position
Standard network communication capability
DTU1550:
Wafer size, 12"
Chuck table size, 6"
Cable size, 12"
Spindle isze,12" base
Vacuum pump
Dust collection unit
Clean room and standard manuals
CE Marked
2023 vintage.
DISCO DGP 8761 wafer grinding, lapping and polishing equipment is a full-featured machine designed explicitly for the production, grinding, and polishing of solar cell wafers. An integrated system, it combines grinding, lapping, and polishing in one process for exacting results. At its heart, the unit incorporates a precision grinding unit which accommodates up to 5 grinding heads with two heads being paramount for the lapping operation. During lapping, both head discs are loaded with abrasive, stationary for the course grind and the other rotating for a finer finish. Grinding pressure is adjustable across 3 levels determined by the number of motorized heads. The machine's integrated lapping head accepts 6-inch wafers and processes them using a rotary diamond abrasive disk to achieve a superior surface finish. The pressure applied in the lapping process is also adjustable with an accuracy of 1 PSI. It is further equipped with unique speed variation features for a finer level of control over the process. This versatile tool also allows for a dual-side polishing process. It uses vacuum chuck tables which furnish secure wafer transfer and good surface uniformity. The asset also features machine assisted polishing with which mirror-like reflectivity can be attained with an optimal usage of compound. The model is further equipped with a number of safety features such as a software based NVR (non-volatile RAM) diagnostic solution and user-definable password protection. It also features a crash protection equipment to reduce damage in the event of possible malfunctions. Additionally, the multi-sided design of the system allows for easy access, so that the chuck tables and discs can be removed and replaced quickly and easily. Overall, DISCO DGP8761 is a full-featured unit designed to deliver production grinding, lapping and polishing with unparalleled accuracy and control. Through its integrated machine design, it offers superior productivity and flexibility. With multiple levels of safeguards as well as the ability to produce excellent results, this tool is the ideal solution for any solar cell wafer manufacturing process.
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