Used DISCO DGP 8761 #293829195 for sale

DISCO DGP 8761 is a wafer grinding, lapping, and polishing equipment designed for use in semiconductor production. The system uses a unique approach to wafer processing, utilizing a combination of dicing blades and advanced lapping and polishing techniques to provide superior accuracy and consistency. DISCO DGP8761 has a rigid and robust design that enables superior performance when grinding and lapping wafers. The unit has an automatic feeder that feeds wafers in a continuous linear process, and is capable of rotating up to 1600rpm. The feeder, and all components of the unit, are constructed to be dust proof and functioning at all times, giving consistent and reliable operation. The integrated grinding and lapping machine of the 8761 is capable of grinding and lapping wafers from 2" to 8" in diameter. The dicing blades embedded in the grinding mechanism are capable of accurately and consistently trimming wafers to precision tolerances, ensuring quality and reliability. To further enhance the accuracy of the lapping process, the tool utilizes a two-stage process, using a diamond paste solution for initial rough lapping and a diamond dust solution for the final polishing. Further features of this asset include a vacuum chuck for use with wafer-specific equipment, as well as a removable mesh filter for effective dust collection. The integrated display allows for easy configuration and setting of parameters, as well as real-time monitoring of the process. The model is designed with safety in mind, featuring an emergency stop feature as well as environmental protection features such as an emergency power cut-off switch. Overall, DGP 8761 is a highly advanced wafer grinding, lapping and polishing equipment that provides excellent accuracy and efficiency when processing wafers. With its robust construction and integrated features, DGP8761 is the ideal system for semiconductor processing and research.