Used DISCO DGP 8761 #293831540 for sale

DISCO DGP 8761 Wafer Grinding, Lapping & Polishing Equipment is designed to precisely shape and grade wafers in a range of sizes and thicknesses. DISCO DGP8761 utilizes advanced precision technologies to ensure accurate repeatability, with a high degree of tool stability even under high loads. Wafers are evenly distributed on the spindle and retained with air bearings for perfect lapping quality and surface consistency. DGP 8761 utilizes four integrated lapping heads and one grinder, coupled with a swing arm to allow for greater reach and faster processing times. Each lapping head has a rotating lapping plate, adjustable yield rings, and an in-place brush ring to facilitate superior lapping and polishing performance. The lapping heads can be configured to assure optimal performance based on the wafer size, thickness, and material properties. The grinding spindle features a variable frequency drive that can adjust the spindle speed from 500 to 15,000 RPM for different materials and applications. In addition, the system is designed with an automated loading and unloading station that can raise or lower the unloaded wafers. This allows for a continuous processing time to improve throughput. The unit also includes a centralized operator interface with video capabilities that allows for real-time monitoring and control of the process. A dedicated navigation machine allows operators to quickly set up desired process parameters or move through a library of pre-programmed procedures for single- and multi-wafer processes. The machine's advanced imaging tool also ensures variable wafer thicknesses are precisely aligned to obtain uniform wafer results. DGP8761 Wafer Grinding, Lapping & Polishing Asset is an ideal choice for process engineers and operators looking for precision control and uniform results from wafer processing. With its advanced features and efficient design, DISCO DGP 8761 is ideal for a variety of industries, such as semiconductor, MEMS, and wafer fabrication.