Used DISCO DGP 8761 #9056954 for sale

DISCO DGP 8761 is an advanced wafer grinding, lapping and polishing equipment. This system provides versatile and precise precision processes for a variety of applications. It is designed specifically for high-performance semiconductor grinding and polishing of wafers. DISCO DGP8761 features a wide peripheral speed range of 0.1-800 rpm for wafer grinding, lapping and polishing tasks. It is equipped with a high-precision servo driving unit and a wide range of grinding wheels for different applications. Moreover, the machine is capable of smoothly controlling all application-related parameters. The tool also features micro- and nanoscale lapping including mirror-level polishing, enabling uniform results at the nanoscale level. It can process wafers from as small as 200 μm to as large as 12" in diameter. Furthermore, it has the highest degree of accuracy when grinding, lapping and polishing material substrates. The asset is designed to run safely and efficiently with a built-in safety plate. It also includes a coolant model for the running and protection of the grinding wheel. The equipment is also equipped with real-time control and monitoring to minimize grinding time and increase productivity. In addition, DGP 8761 has an intuitive 10.4" touch screen, which provides an easy-to-use graphic user interface. This enables users to quickly set up, adjust, and operate all available functions. Moreover, the system has an advanced self-diagnostic feature to alert the operator for any errors that occur during the operation process. Overall, DGP8761 is a versatile grinding, lapping and polishing unit with versatile and precise precision processing capabilities. It is well suited for high-precision semiconductor grinding and polishing of wafers from 200 μm to 12" in diameter. It has advanced features such as a wide peripheral speed range, a high-precision servo driving machine, and real-time control and monitoring to ensure efficient and safe operation.