Used DISCO DGP 8761 #9092589 for sale

DISCO DGP 8761 is a versatile wafer grinding, lapping and polishing equipment designed for processing a wide range of materials. It is suitable for a range of applications including semiconductor device production, MEMS manufacturing, and nanotechnology. This system is based on a precision spindle with an adjustable speed. It allows grinding and lapping of various wafer sizes, including samples ranging from 50 mm to 350 mm in diameter. The rotational speed of the spindle can be adjusted from 0 to 9500 rpm, enabling precise and uniform results. The speed is also adjustable in small increments for finer control. In addition, the unit can be used with multiple grinding wheels, allowing for a variety of cutting processes. A unique feature of DISCO DGP8761 is its air damper, which helps to reduce vibration and ensure a smooth grinding and lapping process. This helps to reduce the risk of breaking and chipping while providing a higher quality end product. In addition, this machine is equipped with a vacuum device for removing any dust and particles generated during the grinding and lapping process. The tool also features a dual-side asset that allows for a wide range of lapping processes. It includes two lapping plates that can be used for both rough and fine lapping. The user can easily adjust the gap between the lapping plates, finely controlling the lapping process. This feature makes the model suitable for production of wafers of different thicknesses. The equipment also includes an advanced monitor and control unit. This allows for close monitoring of the grinding, lapping and polishing processes. The user can easily adjust settings such as spindle speed, air damper pressure, and lapping plate gap to ensure precise results. Finally, the system is designed for low-maintenance operation. It has durable components that are easy to clean and maintain. This makes it a great option for a variety of settings including factories, laboratories and research institutes. In all, DGP 8761 is an advanced and reliable unit for precise wafer grinding, lapping and polishing. It is perfect for producing a wide range of projects and its low-maintenance design makes it easy to use and maintain.