Used DISCO DGP 8761 #9101537 for sale

DISCO DGP 8761 'wafer grinding, lapping and polishing' equipment is a comprehensive, automated wafer processing solution for producing uniform surfaces of high accuracy. Featuring an integrated multi-stage wet processing system, DISCO DGP8761 is designed to grind, lap and polish single crystal wafers of up to 200 mm in diameter. It is capable of producing flat wafer surfaces with a root-mean-square (RMS) roughness rating of less than 0.1 nm. The unit features an advanced multi-axis control platform and multiple-step processing formats that enable it to accurately process a wide range of semiconductor materials, including GaAs, Sapphire, Silicon-on-Insulator (SOI), and GaN-on-Si. It can be configured with multiple grinding heads and is equipped with advanced temperature and vibration control systems that reduce material stress while increasing efficiency. Additionally, the 8761 utilizes a non-contact, nanometric displacement detector to measure and control the grinding process for superior surface accuracy. The 8761 is also equipped with a selection of grinding, lapping, and polishing tools and attachments, including tapered and burr tool sets, diamond grinding discs, and polishing pads. Other advanced features include a wafer cassette machine that enables efficient handling and processing of multiple wafers, an integrated process control tool, and a data logging and analysis asset for comprehensive process documentation. For high-precision surface lapping, DGP 8761 uses a floating head design that automatically compensates for thermal distortion of the workpiece during processing. In combination with highly efficient process parameters, this feature improves the machine's ability to perform precision lapping and polishing of wafers. DGP8761 wafer grinding, lapping and polishing model is an ideal solution for producing quality surfaces for both consumer and commercial devices. Its highly automated, precise and efficient features make it well-suited for a wide range of applications, from the production of high-performance semiconductor devices to the replication of delicate micro-optics. Additionally, its integrated process control and data logging capabilities increase throughput while providing comprehensive reporting and analysis of production processes.