Used DISCO DGP 8761 #9207251 for sale

DISCO DGP 8761 is a fully-automated wafer grinding, lapping and polishing equipment designed specifically for the production of silicon, ceramic and compound semiconductor wafers. This versatile system can process a variety of wafer sizes up to and including 300mm in diameter with a thickness between 4mm and 16mm. Equipped with an industrial-grade CNC platform and the latest grinding, lapping and polishing tools, DISCO DGP8761 is capable of executing complex cycles that eliminate the need for long-time manual operation, often reducing grinding time significantly. The unit also uses advanced vision systems (UCS) to automate chip placement in the wafer surface for precise edge grinding, lapping and polishing. When equipped with an optional auto-gauging mechanism, DGP 8761 can accurately and purpose-specifically inspect wafer topography while it is being processed, manipulating parameters of the grinding, laping and polishing process in order to achieve a perfect surface finish. Through this method, the machine reduces grinding cycle times and waste significantly when compared to traditional methods. To further enhance the user experience, DGP8761 also comes equipped with the option of a visual remote user interface, allowing for remote operation and real-time monitoring of all grinding, lapping and polishing processes. The automatic defect detection and pinpoint accuracy of the control tool applied to every grinding, lapping and polishing operation also makes this tool ideally suitable for a wide range of materials and specialised applications. At the same time, the asset can be fully integrated with other advanced systems to enable the full automation of the production process, including robotic load/unload functions. DISCO DGP 8761 also uses an automated grinding/lapping/polishing window model, allowing users to optimise their cycle times no matter the wafer size or thickness. To summarise, DISCO DGP8761 is a highly efficient and reliable equipment that offers the user a fully-automated, integrated and safe process for the production of semiconductor wafers. With its advanced control system, visual user interface and smart functions, this tool can reduce cycle times and total product waste significantly.