Used DISCO DGP 8761 #9208355 for sale
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ID: 9208355
Vintage: 2009
Grinder / Polisher
CMP Process
Z1: Infeed grinder
Air bearing
High frequency motor: 6.3 kW (1000-4000 min-l)
Height gage: 0 - 1.8 mm
Wheel: 300 mm
Z2: Infeed grinder
Air bearing
High frequency motor: 6.3 kW (1000-4000 min-l)
Height gage: 0 - 1.8 mm
Wheel: 300 mm
Z3: CMP
Air bearing
High frequency motor: 11.0 kW (200-800 min-l)
Non contact gage
Wheel: 450 mm
Chuck table:
(4) Tables
Vacuum chuck
0-800 min-1
Cleaer 1:
Brush clean
Wafer rotation: 10-60 rpm
Brush rotation: 100-600 rpm
DIW, citric acid, O3 (0.4-1.51/min)
Cleaer 1:
Spin clean
Wafer rotation: 30-1800 rpm
DIW, Citric acid, O3 (0.4-1.51/min)
(2) Flow jets, N2 10-50 NL/min
DFM2800 Stand alone system: No
110 LINTEC RAD 2700 Wafer mounter system: No
Cleaning unit (Single wafer processing cleaner):
OEM / SHIBAURA MECHATRONICS SCG300-BS
Chemicals supply equipment: (3) OEM / DISCO FNNN-010000-00
Citric acid preparing equipment: OEM / KIEFER TECH CD CiLllSP B
Citric acid supply equipment: OEM / KIEFER TECH CD-CiR210P-B
2009 vintage.
DISCO DGP 8761 is a Wafer Grinding, Lapping & Polishing equipment designed to handle large wafer sizes and reduce the total polishing time. The wafer grinding, lapping and polishing machine can process up to 8" wafers, and offers low damage grinding for a variety of materials such as SiC, SiN, GaAs, Silicon and glass. The precision grinding spindle and high-precision lapping system produce results with the lowest possible surface roughness, while maintaining the lowest possible chip removal rates. The unit utilizes an in-line grinding architecture in which lapping and grinding are coordinate with each other to optimize the total polishing process. It is designed to reduce non-uniformity of the workpiece surface and minimize wafer-to-wafer variation during processing. The machine is equipped with an integrated wafer edge grinding machine which allows for easy repositioning and reduction of edge burrs near the wafer edge after grinding. DISCO DGP8761 features fast wafer rotation speed for better autofocusing, improved productivity and enhanced process uniformity. The machine is also configured with a temperature controlled process medium tank to ensure an optimal condition for the grinding process. The tool is equipped with a programmable height control asset, allowing for precise control of the grinding wheel over the wafer's surface. The model also includes a VIS200 control unit, which offers a user-friendly graphical user interface with onboard diagnostics. This interface allows for easy parameter settings, including sample sizes, sample shapes, grinding wheel diameters, and polishing speeds. The control unit links to a computer, to enable long-term monitoring of process data as well as data storage. DGP 8761 meets various grinding and lapping applications and is ideal for the semiconductor industry, as it produces highly accurate results, and offers ease of use, with its simple user interface and onboard diagnostics. It is a cost-effective and reliable solution to granular and micro-level wafer processing.
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