Used DISCO DGP 8761 #9227613 for sale

DISCO DGP 8761 is a state-of-the-art wafer grinding, lapping and polishing equipment, developed to provide repeatable, consistent and reliable conditioning of single side and device edge surfaces. This system combines the precision and accuracy of a dedicated Dicing Unit with the high-speed processing of a conventional grinding, lapping and polishing machine. The 8761 is the perfect choice for conditioning a variety of substrates designed for flip-chip and wafer-level packaging applications. To meet the most challenging industry requirements, the 8761 is designed to deliver exceptional conditioning performance with a wide range of substrates, from silicon and glass wafers to MEMS devices. The machine is capable of achieving a high degree of surface flatness and parallelism, as well as ultra-low defect rates, making it ideal for advanced packaging applications. The 8761 tool includes a 4-axis motion controlled dicing head and a precision-chuck asset, with options for various kinds of wafer holders. High-powered, high-accuracy sensitive abrasive and polishing plates are used to ensure clean and repeatable surface conditioning. The dedicated backlash-free XYZ motion control model, together with a high-resolution linear encoder, ensure precise, repeatable and reliable dicing results. Additional features in the 8761 include a Programmable Sequence Equipment, which allows users to program lapping, grinding and polishing processes quickly and efficiently, as well as a "wafer repeatability" feature for automated substrate measurement. DISCO DGP8761 is a versatile platform that can fulfill the most demanding applications in wafer processing. Its advanced design and reliable conditioning performance demonstrate that DISCO remains at the vanguard of wafer grinding, lapping and polishing machines. Whether you're looking for a single side or device edge surface conditioning solution, the 8761 is the perfect choice for clean, repeatable and reliable processes.