Used DISCO DGP 8761 #9237137 for sale

DISCO DGP 8761 is a wafer grinding, lapping, and polishing equipment from DISCO Corporation that is designed to provide exceptionally precise results for the semiconductor industry. This system is capable of processing almost all types of semiconductor wafers, such as silicon, GaAs, Ge, SOI, GaN, SiC, InP, and others. It can handle wafers up to 8-inches in diameter, with a maximum thickness of 0.029 inches. The unit also has a range of optional accessories available, including wafer chucker, polishing slurry jig, and a platen surface contact machine. DISCO DGP8761 has an efficient, modular design that includes an integrated, programmable controller, an intuitive user interface, and a large LCD display. The programmable controller allows users to customize their settings to achieve high accuracy results in wafer grinding, lapping, and polishing processes. The user interface can be easily adjusted to create grinding, lapping, or polishing programs, to control wafer chucking or loading, and to check for production process errors. The LCD display enables the user to monitor key process information such as temperature, polishing load, and process parameters. The advanced grinding and polishing technology of DGP 8761 enables precision control of wafer thickness profiles and flatness. The machine is also equipped with a noise reduction tool to reduce sonic reflection during grinding and polishing operations. To ensure maximum precision, a high-precision guiding asset with focal line scanning technology is included. This ensures accurate alignment between the polishing and grinding processes, so the wafers fabricated on the model are smooth and precise. To maximize throughput, the machine is also equipped with a high-capacity wafer storage equipment. This enables users to pre-set and store values for processes on multiple wafers in a single operation. In addition, the system is fully automatic and operation is monitored remotely via Ethernet. This allows for efficient production management across multiple sites and the ability to transfer data to a remote plant. Overall, DGP8761 is a reliable, precise, and efficient wafer grinding, lapping, and polishing unit that ensures high-precision results for the semiconductor industry. It has a range of advanced features and optional accessories that enable users to produce quality wafers with extraordinary precision.