Used DISCO DGP 8761 #9238627 for sale

DISCO DGP 8761 is an advanced wafer grinding, lapping and polishing equipment designed for high-precision machining of large silicon and other semiconductor substrates. This system is capable of producing extremely fine surface finishes while achieving sub-micron level precision on the order of 0.1 µm. The unit consists of a main spindle and an automated end effector which allows for precise and accurate positioning of the wafer at the grinding head. The load port, which is integrated into the machine, enables quick and easy loading and unloading of up to five wafers simultaneously. Additionally, DISCO DGP8761 features an advanced macro-level control software and a G-code motion controller, allowing the user to program complex cutting cycles and optimize machining parameters for a wide range of materials. Furthermore, the tool is equipped with a diamond grinding wheel and a revolving compact lapping plate that ensure smooth and even grinding. DGP 8761 utilizes a new type of high-precision linear motor for rapid acceleration and smooth low-vibration operation. This asset is capable of producing extremely fine surface finishes, while working on soft materials such as copper and other alloys. In addition, DGP8761 is highly effective in grinding and polishing large and thin rigid materials like glass and quartz. The advanced software of DISCO DGP 8761 provides a comprehensive monitoring model that allows the operator to adjust the grind speed and make real-time adjustments as well as track performance and production quality. Furthermore, the equipment is equipped with a variety of safety features including auto-shutoff in the event of an emergency. In conclusion, DISCO DGP8761 is one of the most advanced wafer grinding, lapping and polishing systems on the market today. Its high-precision linear motor and comprehensive monitoring system make it suitable for a wide range of applications, from mass-production to high-precision machining.