Used DISCO DGP 8761 #9241438 for sale

DISCO DGP 8761 is a high-performance wafer grinding, lapping, and polishing equipment designed to increase yield and throughput of planarization processes. The system features a compact foot print and incorporates several advanced technology features, including advanced control unit, automated wafer loading/unloading, and optimal material removal performance. The main component of DISCO DGP8761 machine is the precision-built grinding/lapping machine, which is equipped with a diamond grinding wheel. The machine is capable of producing a near-perfect flat surface with little to no defects, allowing for a precise and consistent substrate surface finish. In addition, thanks to its advanced control tool, the machine can accurately set the rate, depth, and speed of material removal, allowing for precise and repeatable process results. DGP 8761 is an ideal solution for polishing semiconductor wafers for different applications, including MEMS, LEDs, and flat-panel displays. It is capable of processing a variety of wafer sizes, with a maximum range of up to eight-inch wafers. The asset incorporates an automated wafer loading/unloading model that is capable of loading and unloading wafers in a rapid, efficient manner. DGP8761 is powered by an adjustable, three-phase AC motor which allows for a power output ratio ranging from 0.75kW to 4kW, allowing for optimal performance even in high-load conditions. In addition, the equipment also incorporates a heat exchanger that helps maintain a stable operating temperature. The advanced control system used in DISCO DGP 8761 helps to ensure precise material removal, while its user-friendly interface makes machine operations and process control simple and intuitive. The unit can store up to 99 recipes, allowing for quick switching between different types of processing. In addition, the machine is compatible with most industry-standard software, helping to integrate it to existing processes. Overall, DISCO DGP8761 is a powerful and versatile wafer grinding, lapping, and polishing tool that offers an ideal solution for planarization processes. The machine features a compact footprint, optimal grinding performance, and a reliable control asset, all of which help to improve yield and throughput.