Used DISCO DGP 8761 #9245448 for sale

DISCO DGP 8761 is an advanced wafer grinding, lapping, and polishing equipment. This system can polish and grind surfaces to the tightest surface finish tolerances. With its optimal balance between time and precision, this unit is ideal for patterned and non-patterned surfaces. This machine is configured with a central processing unit (CPU) controller, air bearing spindle, lapping platen, and polishing platen. The controller houses the tool's control board, allowing complete automation of the grinding, lapping, and polishing operations. The asset utilizes an air bearing spindle with a high speed, high torque motor to grind and lap the wafer surface. The lapping platen employs a unique two-stage conversion motor to reduce platen load without sacrificing cutting speed. This results in improved surface finish and reduced wear. The polishing platen is designed to work with polishing Pads of various materials for different polishing applications. The model also houses a high-precision linear scale, separate from the grinding and lapping platen. This digital scale allows for greater accuracy of the wafer when grinding and lapping. With high controllability and fine adjustments, enhanced surface finish accuracies and repeatability is achieved. Additionally, the equipment includes an intuitive LCD touch-screen monitor, equipped with diagnostic programs, real-time datalogging, and other features for easy operation and maintenance. DISCO DGP8761 is the ideal solution for cost-sensitive semiconductor production environments. Additionally, due to its scale and portability, this system can be easily incorporated into existing production lines. With a low power consumption, minimal noise, and vibration-free operation, this unit provides an efficient and reliable solution in a wide range of wafer grinding, lapping, and polishing fundamentals.