Used DISCO DGP 8761 #9255254 for sale

DISCO DGP 8761 is a wafer grinding, lapping & polishing equipment designed for production of high quality wafers for semiconductor manufacturing applications. The system is capable of producing a high level of surface finish on wafers ranging in size from 1 inch to 12 inch (25mm - 300mm). It features dual X-Y tables allowing for the simultaneous grinding, lapping and polishing of one wafer. The heart of the unit is the abrasive media. The media used is a specific combination of diamond and alumina and is available in three different mesh sizes. The diamond particles are used for grinding and the alumina particles provide a finer level of polishing. The abrasive media is held in place on the grinding platen by vacuum, eliminating clogging between the individual layers of media. The machine also contains a slurry handling tool that automatically cleans and recycles the slurry used for wafer lapping and polishing. Aqueous fluids such as deionized water, surfactant, and methanol can be adjusted to provide precise control of the process. The slurry is recirculated through the process, keeping any potential contaminants away from the wafers and allowing for a cleaner process. The asset also features an integrated wafer handling model for moving the wafers from the grinding and lapping polishing area to the cleaning station. The wafers are held firmly in place on the X-Y tables during the process, eliminating wafer slip and damage. The equipment also contains a sophisticated control system that allows the user to precisely monitor and adjust the grinding, lapping and polishing parameters. Features such as wafer tracking, temperature control, and speed control provide users with increased accuracy and control. The unit utilizes a variety of sensors to monitor the process and alert the user of any abnormalities in the process. This prevents unnecessary waste of materials and time and prevents potential damages to the wafers due to incorrect processing. Overall, DISCO DGP8761 is an advanced wafer grinding, lapping & polishing machine that offers users the ability to produce superior quality wafers in an efficient and clean manner. It's versatile, easy to use interface makes it a perfect choice for a variety of manufacturing applications.