Used DISCO DGP 8761 #9256500 for sale
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ID: 9256500
Wafer Size: 12"
Vintage: 2009
Grinder / Polisher, 12"
Stand-alone
(2) Power exchangers
Wet polishing
CMP
UPS
OWSC-2007AS
VG256-15Z-D06 Vacuum unit
Z1 and Z2:
In-feed grinder
With wafer rotation
Air bearing
6.3 kW High frequency motor: 1000-4000 min⁻¹
Height gauge: 0-1.8 mm
Wheel, 12"
Z3: CMP
Air bearing
11.0 kW High frequency motor: 200-800 min⁻¹
Non contact gauge
Wheel, 18"
(4) Chuck tables:
Vacuum chuck
0-800 min⁻¹
Brush clean:
Wafer rotation: 10-60 RPM
Brush rotation: 100-600 RPM
DIW, Citric acid, O3: 0.4 - 1.51/min
Spin clean:
Wafer rotation: 30-1800 RPM
DIW, Citric acid, O3: 0.4 - 1.51/min
N2 10-50 NL / Min (2) Flow jets
Cleaning unit:
SHIBAURA Mechatronics SCG300-BS single wafer processing cleaner
Chemical supply equipment:
(3) DISCO FNNN-010000-00 Chemical supply units
KIEFER TECH CD-CiL115P-B Citric acid preparing equipment
KIEFER TECH CD-CiL210P-B Citric acid supply equipment
Missing parts:
DFM2800
LINTEC RAD2700 Wafer mounter system
2009 vintage.
DISCO DGP 8761HC is a high-precision grinder, lapper and polisher for processing large, semiconductor wafers. This equipment is designed with a high-speed, direct drive spindle that ensures superior accuracy in the grinding and lapping processes. The machine is capable of grinding, lapping and polishing wafers up to 6 inches in diameter and its controlled, multi-axial motion allows for precise targeting of wafer features. Additionally, the system includes temperature and pressure control capabilities to ensure consistent results. DISCO DGP8761HC is equipped with a rotating, programmable workhead with independent, adjustable speed and torque settings. This feature enables the unit to attain perfect alignment of the wafer surface with the grinding wheel, ensuring superior grinding results. The machine also incorporates a high-precision spindle and a dust-proof enclosure to maximize the performance of the grinding wheel and minimize abrasive dust contamination. Furthermore, a virtual presence tool allows a remote user to monitor and control the asset operation from a secure location. This model is ideal for the grinding and lapping of wafers for various applications including hypersonic, MEMS, surface planarization, and power and device substrates. It is capable of processing very complex devices patterns with superior accuracy. Additionally, the equipment utilizes a reproducible, automated lapping process that is capable of removing material up to 10 microns in precision. Furthermore, the system is equipped with an in-process metrology capability that provides real-time feedback to adjust and ensure consistent grinding results. Overall, DGP 8761 HC is a high-precision unit for grinding, lapping and polishing semiconductor wafers up to 6 inches in diameter. Its direct-driven, high-performance spindle and programmable workhead provide superior accuracy in the grinding and lapping processes. It is also equipped with temperature and pressure control capabilities as well as an in-process metrology machine to ensure consistent results. Additionally, this tool is capable of reproducible automated lapping and is ideal for the grinding and lapping of wafers for various applications.
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