Used DISCO DGP 8761 #9262174 for sale

DISCO DGP 8761 is a state-of-the-art wafer grinding, lapping and polishing equipment designed specifically for wafer processing. It features a six axis robot arm for precise positioning and a high-speed spindle for efficient abrasive removal. The system features an integrated cleaning unit that is designed to provide optimal cleaning, and also provides dual-sided machining for improved uniformity. The integrated cleaning machine can be used for both wet and dry processing, and includes an auto-controlled scrubber for superior cleaning results. DISCO DGP8761 is a versatile tool that can machine a wide range of substrates, shape, and size, including both silicon and compound materials. This superior versatility allows for a wide range of spindles and grinding, lapping, and polishing tools. This includes diamond dust grinding for superior finish, as well as a combination of abrasives and polishing tools for accomplishing a superior finish. Additionally, it can accommodate a range of grinding and polishing accessories for specific material, application, and substrate requirements. The asset utilizes two high-performance motors to achieve a peal of 50,000 rpm at a feed rate of up to 140 m/min. This enables the model to produce a high quality finish with excellent surface purity and accuracy. Additionally, the advanced lubrication equipment helps to protect the parts against wear and the spindle against vibration and overheating. Additional features of DGP 8761 include disposable cassette adapters and a passive dust collection system. The disposable cassette adapters help to reduce contamination by preventing parts from coming into contact with the metal surfaces of the cassette. The passive dust collection unit helps to maintain a clean working environment by collecting and removing dust and debris. DGP8761 is an industry-leading wafer grinding, lapping, and polishing machine designed to increase process efficiency and reduce downtime. It features an integrated cleaning tool, a wide array of grinding and polishing tools, high-performance motors, and a passive dust collection asset to help maintain an optimal working environment. Additionally, it has a compact and robust design, so it is easy to transport and install. This model is ideal for applications ranging from wafer planarization to total wafer processing.