Used DISCO DGP 8761 #9265599 for sale

DISCO DGP 8761 is a world-leading wafer grinding, lapping and polishing equipment. This system offers unprecedented performance and automation capabilities for the most demanding applications in the semiconductor and research industries. DISCO DGP8761 features a three-axis bridge unit, including both linear and mid-axis motors and a high-precision, computer-controlled wafer-handling machine all which provide the necessary level of accuracy and precision. Its tool is capable of grinding, lapping and polishing crystal wafers to nanometer accuracy, ensuring reliable and repeatable process results. The three-axis bridge asset of DGP 8761 incorporates a combination of linear and mid-axis motors to ensure balanced motion along the X, Y and Z axes. Its use of individually adjustable static and dynamic balance makes it capable of handling even the most demanding production scenarios and applications. The mid-axis motor is also designed for precise motion control in situations where very slow motion is required, such as when a wafer is being transferred from one station to the next. DGP8761 also features a highly accurate computer-controlled wafer-handling model. The equipment is capable of lifting, rotating and placing wafers in the precise orientation and position with utmost accuracy. It is also equipped with a vision system that is used to detect imperfections or other contaminants on the wafer before the grinding, lapping or polishing process takes place. The advanced fixturing capabilities of the unit allows the user to quickly and easily configure the tooling setup for different applications and program the positions and orientations of the abrasives. The combination of static and dynamic fixturing results in an extremely stable base, allowing for precise grinding and polishing. The included ATW (Adaptive Timing Wheel) can also be used to fine-tune the tooling configuration, providing the user with true control over the outcome of the process. DISCO DGP 8761 is equipped with intuitive software that allows the user to program the machine settings and control the entire process from a single interface. This user-friendly software allows for quick and easy setup and adjustment of tool settings, as well as real-time monitoring of the process. DISCO DGP8761 is an exceptional machine designed for the challenging demands of wafer grinding, lapping and polishing applications. The combination of its three-axis bridge tool, advanced wafer-handling asset, specialized tooling fixtures and intuitive software results in reliable, repeatable, and accurate process results that are unmatched by any other model in its class.