Used DISCO DGP 8761 #9275220 for sale

DISCO DGP 8761 is a high-precision wafer grinding, lapping, and polishing equipment that greatly increases process throughput, with full automation and high accuracy. With an easy-to-use automated scratch abrasion detection and evaluation system, DISCO DGP8761 provides users with tailored solutions that can be used to achieve the desired mechanical surface properties. The unit features an advanced design that is designed to promote repeatable results; the wafer stage is loaded in a rotating table, and the grinding disc is then loaded onto the table. The wafer is loaded onto the table and is securely held in place by a vacuum chuck. The built-in spindle is adjustable to allow for adjustment of grinding speed and depth control; the grinding speed can be adjusted to optimize the grinding process. DGP 8761 is equipped with a powerful control machine that can adjust the grinding speed and depth for each operation. DGP8761 tool's lapping mechanism is driven by an advanced servo motor and can be precisely adjusted to accommodate various wafer sizes and applications. The grinding disc is adhesively mounted to the wafer and lapped on both sides using a diamond compound slurry. A specialized lapping plate is used to apply pressure to the wafer in order to generate a uniform profile. The adjustable pressure applied to the grinding disc ensures that the wafer is consistently lapped with an even finish. To maximize process throughput, DISCO DGP 8761 is equipped with a high-performance polish head. The polish head is used to apply a polishing agent to both sides of the wafer which results in a high-quality surface finish. The polish head features a high-powered motor and is adjustable to provide precise control of the polishing process. An advanced protection asset is used to ensure that the wafer is not damaged during the grinding, lapping, and polishing process. The model is designed with sensors that detect any debris, chips, or scratches that may be present and will automatically shut down the equipment should any anomalies be detected. This helps to ensure optimal performance along with preventing damage to the passive components. DISCO DGP8761 is an all-in-one system designed to provide the highest quality of performance with a minimum of manual input. The automated scratch and abrasion detection and evaluation unit, in combination with the powerful process control machine ensures that the desired surface mechanical properties will be achieved. The tool's adjustable grinding speed, lapping pressure, and polish head with powerful motor ensures an even finish on both sides of the wafer along with ensuring the maximum process throughput. With DGP 8761, users can be assured of a high-precision, high-performance asset.