Used DISCO DGP 8761 #9281226 for sale

DISCO DGP 8761 is a comprehensive wafer grinding, lapping and polishing equipment that is designed for maximum performance and durability in the most demanding environments. This industrial-grade system offers sophisticated grinding, lapping and polishing capabilities, all of which are engineered to the highest standards of quality. DISCO DGP8761 device features an integrated grinding and lapping disc that delivers an optimal combination of cutting speed, abrasive performance, and workpiece surface accuracy. The disc is fully adjustable, allowing for precise adjustment to meet the exact application requirements. The unique grinding mechanism uses a combination of low-pressure air jets and abrasive materials to evenly and quickly grind and polish the surface of the wafer. The jet also helps to reduce tool wear for maximum durability. DGP 8761 unit uses a three-stage process to achieve the desired level of perfection and accuracy. In the first stage, the wafer is lapped using a specially designed abrasive pad. This step helps to efficiently and safely remove any surface imperfections, while ensuring that the overall visual appearance is homogeneous. In the second stage, the wafer is subjected to grinding using a diamond disc. This step helps to achieve precise surface finishing and a homogenous metallic substrate that is necessary for optimal device performance. Finally, in the third stage, the polished wafer is inspected and then subjected to a standing wave review and a quality control analysis. DGP8761 machine is designed for rapid wafer fabrication and has been tested to ensure reliable and efficient operation. The device is constructed with components made of corrosion-resistant stainless steel and is powered by an efficient yet powerful motorized rotary drive. Additionally, the device can be tailored to meet specific applications with the ability to adjust the disc, feed speed, and abrasive levels to optimize the process. With its easy-to-operate user interface, DISCO DGP 8761 allows for quick and easy set-up and operation. Overall, DISCO DGP8761 is an industrial-grade wafer grinding, lapping, and polishing tool that is well-suited for the most demanding applications. With its advanced grinding capabilities, durable construction, and easy-to-use interface, this asset is an excellent option for those needing a precise and efficient wafer fabrication process.