Used DISCO DGP 8761 #9282627 for sale

DISCO DGP 8761 wafer grinding, lapping and polishing equipment is a state-of-the-art system for producing smooth surfaces with high-quality surfaces on semiconductor wafers. The unit features two main components—an AutoPressure Polisher and grinding head. The polisher is operated by using feed and pressure arms which oscillate in three directions with adjustable speed, frequency, and stroke length. The feed arms are designed to move the wafer surface in a way that uniform pressure is applied for grinding and polishing. This is carried out in a liquid environment, which ensures minimal damage to the surface of the wafer. The grinding head is equipped with a two-flank and four-flank grinding wheel. The two-flank wheel provides grinding of the back of the wafer along with the mid-sections of the front and back. The four-flank wheel is used for the top and bottoms of the front and back sides of the wafer. The grinding wheel is also equipped with a servomotor so that its movement can be controlled precisely. This feature ensures that the surface roughness is reduced to the maximum extent. DISCO DGP8761 wafer grinding, lapping and polishing machine is easy to use, requires minimal maintenance, and has a highly reliable operation. It has a range of parameters adjustable to meet specific process requirements. It can also be operated in a manual or automatic mode and requires a minimal environment with good air quality. This tool is ideal for the production of semiconductor wafers, integrated circuits, and other products that require a high-quality finish. It can also be used for fabrication of products outside of the semi-conductor industry. With its flexibility and ability to produce precision components, this asset is an asset to any manufacturing facility.