Used DISCO DGP 8761 #9364774 for sale

DISCO DGP 8761 is a comprehensive wafer grinding, lapping and polishing equipment. It is designed for the mass production of similar structures such as MEMS devices, SOI wafers, and other electronic components. It is equipped with a series of automated processing steps to ensure precise, high-quality results. DISCO DGP8761 utilizes a single-side-polishing (SSP) method for grinding, lapping, and polishing. A powerful, servo-controlled motor is included, which powers the system's crossfeed table, enabling precise movement of the wafer relative to the main spindle. The unit can also be outfitted with rigid XY-stages, enabling larger workpieces to be processed on the table. The machine uses diamond grinding tools to reduce material to the desired thickness and finish. The diamond grinding wheels are available in a variety of standard and custom-made sizes to accommodate a wide range of workpieces. The tool is capable of achieving ultra-flat surfaces and tight surface finishes with minimal particle loss. The 8761's lapping process removes unwanted material from the surface, producing an even, planar surface. The asset is capable of using a variety of conventional and specialized lapping and polishing compounds, and is capable of producing an optically flat surface profile with minimal particle loss. To ensure a precise finish, the model includes an integrated calibration and inspection equipment. This system has a unique vision unit that is used to acquire a 3D-profile of the workpiece. This data is then used to make any necessary corrections to the tool path to ensure accurate processing parameters. Finally, the 8761 has an integrated cleanroom facility. It includes HEPA/ULPA-equipped cleanroom curtains for keeping contamination to a minimum during processing. It also features an additional safety machine with EMF (electromagnetic field) shielding for sensitive applications. DGP 8761 is a technologically advanced tool designed for precision wafer grinding, lapping, and polishing. Its advanced features enable it to consistently produce highly accurate results, making it an ideal choice for today's MEMS and SOI wafer production facilities.